Transient Characteristics and Performance of a Dual Compensation Chamber Loop Heat Pipe under Various Heat Loads

被引:0
|
作者
Mohanraj, P. [1 ]
Sridhar, R. [2 ]
Gopalakrishnan, T. [2 ]
Manikandan, R. [3 ]
Bhowmik, Abhijit [4 ,5 ]
机构
[1] Jaya Engn Coll, Dept Aeronaut Engn, Chennai 602024, Tamil Nadu, India
[2] Vels Inst Sci Technol & Adv Studies, Dept Mech Engn, Chennai 600117, Tamil Nadu, India
[3] Saveetha Univ, Saveetha Inst Med & Tech Sci, Saveetha Sch Engn, Dept Mech Engn, Chennai 602105, Tamil Nadu, India
[4] Dream Inst Technol, Dept Mech Engn, Kolkata 700104, India
[5] Chitkara Univ, Ctr Res Impact & Outreach, Rajpura 140417, Punjab, India
关键词
EVAPORATOR; TRANSPORT; COOLER;
D O I
10.1155/2024/5808787
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The dual compensation chamber loop heat pipe (DCCLHP) technology shows great promise for efficient thermal management in a variety of applications. This study focuses on refining the startup performance of the DCCLHP, particularly for low heat load conditions in terrestrial settings, by utilizing dual bayonet tubes. Empirical investigations examined the DCCLHP's operational characteristics and improved thermal transfer capabilities across different orientations of the evaporator and compensation chamber (CC), including vertical, 45-degree tilt angle, and horizontal configurations. Key results demonstrate the DCCLHP's ability to manage low heat loads across diverse orientations, achieving over 400 W of heat transfer across a distance of 2.0 m while maintaining stable operation. Notably, the DCCLHP operation did not exhibit any significant instability issues. This work enhances the startup performance of the DCCLHP in various orientations and provides valuable insights into the confined natural circulation phenomenon, crucial for improving the overall thermal management capabilities of the system. In summary, the study highlights advancements in DCCLHP design and its potential to address thermal management challenges in diverse applications, particularly in the aerospace industry, through improved startup performance and enhanced heat transfer capabilities.
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页数:13
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