Modeling of Threshold Voltage Degradation of 22nm FD-SOI nMOSFETs Under Dynamic Voltage Scaling

被引:0
|
作者
Hu, Yibo [1 ]
Ge, Hao [1 ]
Ren, Zhipeng [1 ]
Yin, Yizhe [1 ]
Chen, Jing [1 ]
机构
[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Mat Integrated Circuits, Shanghai 200050, Peoples R China
关键词
Degradation; Stress; Voltage control; Logic gates; Integrated circuit modeling; Threshold voltage; Mathematical models; Fully-depleted silicon on insulator (FD-SOI); positive bias temperature instability (PBTI); dynamic voltage scaling;
D O I
10.1109/TDMR.2024.3414181
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, we investigated a compact model for characterizing Positive Bias Temperature Instability (PBTI) in 22nm FD-SOI nMOSFETs under dynamic voltage scaling (DVS). This model exhibits high flexibility in predicting PBTI-related threshold voltage degradation in both DC and DVS operations. We measured the impact of time-varying stress and recovery bias conditions, revealing a robust correlation between degradation and relaxation. We integrated the coupling of interface traps and fixed charges into the model, which is deemed a significant contribution. As a result, the model demonstrates high predictive accuracy across various stress conditions, including DC/AC, multiple cycles, and different duty cycles.
引用
收藏
页码:463 / 465
页数:3
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