Research on Board Level Reliability of Mounted Ceramic Package

被引：0
|
作者：
Zhang, Qian [1 ]
Chen, Jiang-tao [1 ]
Yang, Zhen-tao [1 ]
Liu, Lin-jie [1 ]
机构：
[1] CETC, Res Inst 13, Shijiazhuang, Peoples R China
来源：
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2023年
关键词：
Board Level Reliability; Ceramic Package; Temperature Cycle; Lead Support Height;
D O I：
10.1109/ICEPT59018.2023.10492066
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Board level reliability of surface mounted ceramic packages was studied based on structural design of ceramic packages. The board level reliability of ceramic packages with different external dimensions and lead support heights was simulated under same temperature cycling conditions. A board level temperature cycling test ranges from -65 degrees C to 150 degrees C was conducted on selected samples. After every 100 cycles, the appearance and resistance of the samples were inspected until board level failure. This article investigated the impact of different external dimensions and lead support heights on board level failure, summarized board level reliability of surface mounted ceramic package, provided guidance for the board level reliability design of similar packages in the future, and formed relevant design specifications.
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页数：4
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