Replacing Phenol and Formaldehyde for Green Adhesive Synthesis by Lignin and Furfural

被引:2
|
作者
Tao, Yehan [1 ]
Zhou, Siying [1 ]
Luo, Qi [1 ,2 ]
Song, Fei [1 ,2 ]
Gong, Xiaoyu [1 ]
Wang, Zhicheng [1 ]
Wang, Haisong [1 ]
Li, Changzhi [2 ]
机构
[1] Dalian Polytech Univ, Coll Light Ind & Chem Engn, Liaoning Collaborat Innovat Ctr Lignocellulos Bior, Liaoning Key Lab Lignocellulose Chem & Biomat, Dalian 116034, Peoples R China
[2] Chinese Acad Sci, Dalian Inst Chem Phys, CAS Key Lab Sci & Technol Appl Catalysis, Dalian 116023, Peoples R China
来源
ACS APPLIED POLYMER MATERIALS | 2024年 / 6卷 / 12期
基金
中国国家自然科学基金;
关键词
lignin; furfural; green adhesive; phenol-formaldehyde; biomass; THERMAL-PROPERTIES; RESIN; DEPOLYMERIZATION; BIOMASS;
D O I
10.1021/acsapm.3c03087
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Traditional phenol-formaldehyde resin involves the use of petrochemical-based phenol and formaldehyde as feedstocks, raising environmental and health concerns. Herein, renewable biobased substances, i.e., lignin and furfural, were employed to partially replace petroleum-based phenol and formaldehyde for developing greener adhesives by batch copolymerization method. The substitution rates of phenol by acetonitrile-extracted lignin and formaldehyde by furfural can reach 80 and 15%, respectively. The application of these greener raw materials can effectively decrease the emission of toxic content, increasing the viscosity and thermal stability without any sacrifice in the binding performance. The resin with 40% phenol substitution rate and 15% formaldehyde substitution rate displayed superior trade-off between bonding strength (a wet tensile strength of 1.68 MPa) and free formaldehyde content (0.21%) among all biobased resins, much superior to those of commercial adhesive (0.7 MPa and 5%) and those prepared with industrial lignin (0.66 MPa and 0.38%). By using two major biomass-derived feedstocks, this work provides a sustainable strategy to develop a green adhesive featuring superior adhesive properties, enhanced environmental compatibility, and improved thermal stability that shows a broader application potential in the adhesive field.
引用
收藏
页码:6897 / 6905
页数:9
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