Thermally Coupled NTC Chip Thermistors: Their Properties and Applications

被引:0
|
作者
Bodic, Milan Z. [1 ]
Aleksic, Stanko O. [2 ]
Rajs, Vladimir M. [1 ]
Damnjanovic, Mirjana S. [1 ]
Kisic, Milica G. [1 ]
机构
[1] Univ Novi Sad, Fac Tech Sci, Novi Sad 21102, Serbia
[2] Inst Nucl Sci INN Vinca, Belgrade 11351, Serbia
关键词
chip thermistors; thermal junction; heat transfer; ELECTRICAL-PROPERTIES; CERAMICS; NI; CO; CU; SPINEL;
D O I
10.3390/s24113547
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th1 and Th2, which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th1 generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th2 receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B10/30 of thermistor resistance was determined. After that, a self-heating current I1 of the input thermistor was measured vs. supply voltage U and ambient temperature Ta as a parameter. Input resistance R1 was determined as a ratio of U and I1 while output thermistor resistance R2 was measured by a multimeter concurrently with the current I1. Temperatures T1 and T2 of both thermistors were determined using the Steinhart-Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.
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页数:13
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