Wetting, droplet evaporation and corrosion behavior of various composite and textured materials

被引:5
|
作者
Misyura, S. Y. [1 ]
Morozov, V. S. [1 ]
Orlova, E. G. [2 ]
Andryushchenko, V. A. [1 ]
机构
[1] Russian Acad Sci, Kutateladze Inst Thermophys, Siberian Branch, 1 Lavrentyev Ave, Novosibirsk 630090, Russia
[2] Natl Res Tomsk Polytech Univ, 30 Lenin Ave, Tomsk 634050, Russia
基金
俄罗斯科学基金会;
关键词
Composite material; Corrosion; Wettability; Contact angle hysteresis; Evaporation rate; SUPERHYDROPHOBIC SURFACE; SESSILE DROPLET; HEAT-TRANSFER; GRAPHENE; ALUMINUM; WATER; RESISTANCE; CONVERSION; MICRO; FABRICATION;
D O I
10.1016/j.ceramint.2024.03.026
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Experimental studies were conducted on the evaporation rate of a droplet located on the surfaces of various composite and textured materials with different wettability at varying surface temperatures. The maximum droplet evaporation rate was recorded on a textured Cu-SiC composite material with superhydrophilic properties. The minimum droplet evaporation rate corresponded to a superhydrophobic AlMg3 substrate obtained using laser texturing with subsequent hydrophobization procedure. An increase in surface temperature led to a significant deterioration of hydrophobicity for a superhydrophobic substrate and a deterioration of hydrophilicity for a superhydrophilic substrate. As a result, with increasing temperature, the influence of the droplet geometry determined by surface wettability on the droplet evaporation rate for these substrates sharply decreases. Advancing and receding dynamic contact angles, as well as contact angle hysteresis were obtained on all studied substrates. It is generally accepted that a hydrophobic surface exhibits less contact angle hysteresis than a hydrophilic one. However, Cu-Si & Scy; composite substrate with a textured hydrophobic surface exhibited the opposite behavior. The contact angle hysteresis on the hydrophobic textured surface was found to be four times higher than that on the hydrophilic polished one. A mechanism was proposed that explains the high contact angle hysteresis and four hysteresis time modes. The minimum hysteresis value corresponded to the superhydrophobic AlMg3 substrate. Anti-corrosion properties were studied for all substrates under consideration. The minimum corrosion current corresponded to a copper substrate with a graphene coating, as well as a superhydrophobic AlMg3 substrate. For a given substrate, there are two corrosion modes with a three-fold difference in the corrosion current. In addition, the wettability behavior of different surfaces was examined using molecular dynamics simulations. The simulation results were found to be consistent with the experimental data.
引用
收藏
页码:19269 / 19282
页数:14
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