Study of 1500 V AlGaN/GaN High-Electron-Mobility Transistors Grown on Engineered Substrates

被引:0
|
作者
Liu, An-Chen [1 ,2 ]
Chen, Pei-Tien [1 ,2 ]
Chuang, Chia-Hao [3 ]
Chen, Yan-Chieh [4 ]
Chen, Yan-Lin [5 ]
Chen, Hsin-Chu [4 ]
Chang, Shu-Tong [6 ]
Huang, I-Yu [7 ]
Kuo, Hao-Chung [1 ,2 ,8 ]
机构
[1] Natl Yang Ming Chiao Tung Univ, Dept Photon, Hsinchu 30010, Taiwan
[2] Natl Yang Ming Chiao Tung Univ, Inst Electroopt Engn, Hsinchu 30010, Taiwan
[3] Natl Yang Ming Chiao Tung Univ, Ind Acad Innovat Sch, Hsinchu 30010, Taiwan
[4] Natl Sun Yat Sen Univ, Inst Adv Semicond Packaging & Testing, Kaohsiung 804201, Taiwan
[5] Natl Chung Hsing Univ, Master Program Semicond & Green Technol, Taichung 402202, Taiwan
[6] Natl Chung Hsing Univ, Dept Elect Engn, Taichung 402202, Taiwan
[7] Natl Sun Yat Sen Univ, Coll Semicond & Adv Technol Res, Kaohsiung 804201, Taiwan
[8] Hon Hai Res Inst, Semicond Res Ctr, Taipei 114699, Taiwan
关键词
GaN on engineered poly-AlN substrates; QST substrate; GaN on Si substrate; HEMT; high breakdown voltage; LEAKAGE;
D O I
10.3390/electronics13112143
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
In this study, we demonstrate breakdown voltage at 1500 V of GaN on a QST power device. The high breakdown voltage and low current collapse performance can be attributed to the higher quality of GaN buffer layers grown on QST substrates. This is primarily due to the matched coefficient of thermal expansion (CTE) with GaN and the enhanced mechanical strength. Based on computer-aided design (TCAD) simulations, the strong electric-field-induced trap-assisted thermionic field emissions (TA-TFEs) in the GaN on QST could be eliminated in the GaN buffer. This demonstration showed the potential of GaN on QST, and promises well-controlled performance and reliability under high-power operation conditions.
引用
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页数:10
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