Feasibility Investigation on a Low-Cost Air-Filled Substrate Integrated Waveguide Array Antenna in V-Band

被引:0
|
作者
Loconsolel, Antonella Maria [1 ]
Mahmoud, Adham [2 ]
Anelli, Francesco [1 ]
Francionel, Vito Vincenzo [1 ]
Ettorre, Mauro [3 ]
Prudenzanol, Francesco [1 ]
机构
[1] Politecn Bari, Dept Elect & Informat Engn, Bari, Italy
[2] Univ Rennes 1, Inst Elect & Telecommun Rennes IETR, Rennes, France
[3] Michigan State Univ, Dept Elect & Comp Engn, E Lansing, MI USA
基金
欧盟地平线“2020”;
关键词
air-filled multilayer SIW; millimeter-wave antennas; corporate-feed network; DESIGN; GHZ;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, Printed Circuit Board technology is considered for the design and fabrication of a multilayer air-filled Substrate Integrated Waveguide array antenna in V-band. Different alternative stack-ups are investigated for lamination considering prepreg materials or assembling with dielectric screws. Performances are compared via simulation in terms of bandwidth, maximum gain, total losses, and easiness of construction. The prototype for the stack-up assembled with dielectric screws is chosen for fabrication for easiness.
引用
收藏
页数:5
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