Air-Filled Substrate Integrated Waveguide - A Flexible and Low Loss Technological Platform

被引：0

作者：

Ghiotto, A. ^{[1
]}

Parment, F. ^{[1
,2
]}

Martin, T. ^{[1
,3
]}

Vuong, T. P. ^{[4
]}

Wu, K. ^{[5
]}

机构：

[1] Univ Bordeaux, CNRS, IMS Res Ctr, Bordeaux INP, F-33405 Talence, France

[2] CNES, 18 Ave Edouard Belin, F-31400 Toulouse, France

[3] Cobham Microwave, 55 Allee Megevie, F-33170 Gradignan, France

[4] Grenoble Inst Technol INPG, Inst Microelect Electromagnetism & Photon, Microwave Characterizat IMEP LAHC, F-38016 Grenoble, France

[5] Polytech Montreal, Polygrames Res Ctr, Montreal, PQ H3T 1J4, Canada

来源：

2017 13TH INTERNATIONAL CONFERENCE ON ADVANCED TECHNOLOGIES, SYSTEMS AND SERVICES IN TELECOMMUNICATIONS (TELSIKS) | 2017年

关键词：

Air-filled substrate integrated waveguide (AFSIW); Millimeterwave; Printed circuit board (PCB); Substrate integrated circuits;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, the air-filled substrate integrated waveguide (AFSIW), offering a technological platform for the design of high performance millimeterwave self-packaged substrate integrated components and systems, is presented. AFSIW is based on low-cost printed circuit board (PCB). Several components, including antennas, filters and couplers, have been theoretically studied and experimentally demonstrated up to 60 GHz. This technology, surpassing its dielectric-filled SIW (DFSIW) counterpart, is expected by the authors to replace the rectangular waveguide technology for future low-cost extremely high data rate communication systems and highly sensitive sensors operating at millimeterwave and beyond.

引用

页码：147 / 149

页数：3

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