Transient Overvoltage Detection Technique for GaN HEMTs Integrated in a 200-V GaN-on-SOI Process

被引:6
|
作者
Murray, S. K. [1 ]
Jiang, W. L. [1 ]
Zaman, M. S. [1 ]
De Vleeschouwer, H. [2 ]
Moens, P. [2 ]
Roig, J. [2 ]
Trescases, O. [1 ]
机构
[1] Univ Toronto, Edward S Rogers Sr Dept Elect & Comp Engn, Toronto, ON, Canada
[2] On Semicond, Oudenaarde, Belgium
基金
加拿大自然科学与工程研究理事会;
关键词
D O I
10.1109/APEC43599.2022.9773399
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Precise control of the applied gate voltage is essential for GaN HEMTs as the margin between their recommended and maximum gate voltages can be as low as 1V. This work presents a GaN power IC with a driver that samples the duration of gate overvoltage during turn-on transients. The overvoltage detection circuitry compares the on-chip gate voltage of the power device with an externally-set reference. During a gate overvoltage event, a pre-charged hold-capacitor is discharged, with the final capacitor voltage indicating the total overvoltage duration. With this single-die solution, the overvoltage period can be measured without the distortion that occurs when observing a high dv/dt signal through bond wire and PCB parasitic elements. The overvoltage detection circuitry is fabricated in a 200-V GaN-on-SOI process alongside an 80-m Omega e-HEMT with an integrated gate driver. Experimental characterization shows that the change in capacitor voltage is a strong predictor of the overvoltage duration, paving the way for using such a system for optimization in active gate drive scenarios.
引用
收藏
页码:1400 / 1405
页数:6
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共 47 条
  • [1] On-Chip Dynamic Gate-Voltage Waveform Sampling in a 200-V GaN-on-SOI Power IC
    Murray, Samantha Kadee
    Jiang, Wan Lin
    Zaman, Mohammad Shawkat
    De Vleeschouwer, Herbert
    Moens, Peter
    Roig, Jaume
    Trescases, Olivier
    [J]. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2022, 10 (06) : 7150 - 7161
  • [2] 1.4-kV AlGaN/GaN HEMTs on a GaN-on-SOI Platform
    Jiang, Qimeng
    Liu, Cheng
    Lu, Yunyou
    Chen, Kevin J.
    [J]. IEEE ELECTRON DEVICE LETTERS, 2013, 34 (03) : 357 - 359
  • [3] 200 V Enhancement-Mode p-GaN HEMTs Fabricated on 200 mm GaN-on-SOI With Trench Isolation for Monolithic Integration
    Li, Xiangdong
    Van Hove, Marleen
    Zhao, Ming
    Geens, Karen
    Lempinen, Vesa-Pekka
    Sormunen, Jaakko
    Groeseneken, Guido
    Decoutere, Stefaan
    [J]. IEEE ELECTRON DEVICE LETTERS, 2017, 38 (07) : 918 - 921
  • [4] 200 V GaN-on-SOI Smart Power Platform for Monolithic GaN Power ICs
    Cosnier, T.
    Syshchyk, O.
    De Jaeger, B.
    Geens, K.
    Cingu, D.
    Fabris, Elena
    Borga, M.
    Vohra, A.
    Zhao, M.
    Bakeroot, B.
    Wellekens, D.
    Magnani, A.
    Vudumula, P.
    Chatterjee, U.
    Langer, R.
    Decoutere, S.
    [J]. 2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2021,
  • [5] Device optimization for 200V GaN-on-SOI Platform for Monolithicly Integrated Power Circuits
    Syshchyk, Olga
    Cosnier, Thibault
    Huang, Zheng-Hong
    Cingu, Deepthi
    Wellekens, Dirk
    Vohra, Anurag
    Geens, Karen
    Vudumula, Pavan
    Chatterjee, Urmimala
    Decoutere, Stefaan
    Wu, Tian-Li
    Bakeroot, Benoit
    [J]. ESSDERC 2022 - IEEE 52ND EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC), 2022, : 245 - 248
  • [6] Monolithic Integration of a 5-MHz GaN Half-Bridge in a 200-V GaN-on-SOI Process: Programmable dv/dt Control and Floating High-Voltage Level-Shifter
    Jiang, Wan Lin
    Murray, Samantha Kadee
    Zaman, Mohammad Shawkat
    De Vleeschouwer, Herbert
    Roig, Jaume
    Moens, Peter
    Trescases, Olivier
    [J]. 2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021), 2021, : 728 - 734
  • [7] GaN-on-SOI: Monolithically Integrated All-GaN ICs for Power Conversion
    Li, X.
    Amirifar, N.
    Geens, K.
    Zhao, M.
    Guo, W.
    Liang, H.
    You, S.
    Posthuma, N.
    De Jaeger, B.
    Stoffels, S.
    Bakeroot, B.
    Wellekens, D.
    Vanhove, B.
    Cosnier, T.
    Langer, R.
    Marcon, D.
    Groeseneken, G.
    Decoutere, S.
    [J]. 2019 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2019,
  • [8] Suppression of the Backgating Effect of Enhancement-Mode p-GaN HEMTs on 200-mm GaN-on-SOI for Monolithic Integration
    Li, Xiangdong
    Van Hove, Marleen
    Zhao, Ming
    Geens, Karen
    Guo, Weiming
    You, Shuzhen
    Stoffels, Steve
    Lempinen, Vesa-Pekka
    Sormunen, Jaakko
    Groeseneken, Guido
    Decoutere, Stefaan
    [J]. IEEE ELECTRON DEVICE LETTERS, 2018, 39 (07) : 999 - 1002
  • [9] An Asynchronous Buck Converter by Using a Monolithic GaN IC Integrated by an Enhancement-Mode GaN-on-SOI Process
    Noike, Shumpei
    Nagao, Junichiro
    Furuta, Jun
    Kobayashi, Kazutoshi
    [J]. 2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2021, : 215 - 219
  • [10] Buffer Vertical Leakage Mechanism and Reliability of 200-mm GaN-on-SOI
    Li, Xiangdong
    Zhao, Ming
    Bakeroot, Benoit
    Geens, Karen
    Guo, Weiming
    You, Shuzhen
    Stoffels, Steve
    Lempinen, Vesa-Pekka
    Sormunen, Jaakko
    Groeseneken, Guido
    Decoutere, Stefaan
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (01) : 553 - 560