Aerogel for Multipactor Mitigation in RF Passive Components of Satellite Payloads

被引：0

作者：

Vague, Jose Joaquin ^{[1
]}

Goussetis, George ^{[2
]}

Boria, Vicente E. ^{[1
]}

Kunes, Mark ^{[2
]}

Simoes, Fernando ^{[3
]}

Bouzekri, Oilid ^{[4
]}

Reglero, Marta ^{[1
]}

Mata, Rafael ^{[5
]}

Raboso, David ^{[4
]}

机构：

[1] Univ Politecn Valencia, Dept Comun, ITEAM, Valencia 46022, Spain

[2] Heriot Watt Univ, Edinburgh EH14 4AS, Scotland

[3] Active Aerogels Ltd, P-3045508 Coimbra, Portugal

[4] European Space Agcy ESA, European Space Res & Technol Ctr ESTEC, NL-2201 AZ Noordwijk, Netherlands

[5] Univ Valencia UVEG, Val Space Consortium VSC, Valencia 46010, Spain

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2024年

关键词：

Radio frequency; Powders; Electrons; Geometry; European Space Agency; Permittivity; L-band; Aerogel; cavities; dielectrics; multifactor effect; resonators; RF breakdown; HELICAL RESONATOR FILTERS;

D O I：

10.1109/TMTT.2024.3392949

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We investigate the use of aerogel to fill passive resonant components, encountered in the high-power stage of satellite payloads as a multipactor mitigation strategy. The study focuses on the $L$ -band coaxial resonators filled with aerogel powder. Simulated and experimental results are used for the low-power characterization of the dielectric properties of different aerogel compositions and granular distributions. Experimental investigations on the venting and outgassing features that provide guidance for the preparation and handling of the aerogel-filled components are reported. Simulation and experimental results involving high-power test campaigns indicate strong potential for improving the multipactor threshold using the proposed approach.

引用

下载

页码：1 / 0

页数：11

共 50 条

[31] Embedded passive components in MCM-D for RF applications
Ju, CW
Lee, SP
Lee, YM
Hyun, SB
Park, SS
Song, MK
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 211 - 214
[32] DATA MODULATION DEMODULATION CIRCUITS USING PASSIVE RF COMPONENTS
TENDICK, CB
MICROWAVE JOURNAL, 1985, 28 (07) : 188 - 190
[33] ANALYSIS OF RADIATION BEHAVIOR OF CHARACTERISTICS OF PRECISION RF PASSIVE COMPONENTS
Grebenkina, A., V
Kessarinskiy, L. N.
Boychenko, D., V
2014 24TH INTERNATIONAL CRIMEAN CONFERENCE MICROWAVE & TELECOMMUNICATION TECHNOLOGY (CRIMICO), 2014, : 872 - 873
[34] Seismic response mitigation of chemical plant components by passive control techniques
Paolacci, F.
Giannini, R.
De Angelis, M.
JOURNAL OF LOSS PREVENTION IN THE PROCESS INDUSTRIES, 2013, 26 (05) : 924 - 935
[35] Accurate Synthesis of Integrated RF Passive Components Using Surrogate Models
Passos, F.
Gonzalez-Echevarria, R.
Roca, E.
Castro-Lopez, R.
Fernandez, F. V.
PROCEEDINGS OF THE 2016 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE), 2016, : 397 - 402
[36] Symmetric 3D passive components for RF ICs application
Chen, WZ
Chen, WH
2003 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS, 2003, : 599 - 602
[37] Compact macro-modeling for on-chip RF passive components
Yu, H
He, L
Tan, SXD
2004 INTERNATIONAL CONFERENCE ON COMMUNICATION, CIRCUITS, AND SYSTEMS, VOLS 1 AND 2: VOL 1: COMMUNICATION THEORY AND SYSTEMS, 2004, : 1195 - 1199
[38] Extrinsic loss mechanisms in BST for tunable RF/microwave passive components
Akdogan, EK
Bellotti, J
Safari, A
PROCEEDINGS OF THE 2001 12TH IEEE INTERNATIONAL SYMPOSIUM ON APPLICATIONS OF FERROELECTRICS, VOLS I AND II, 2001, : 191 - 194
[39] Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components
Raj, P. Markondeya
Chakraborti, Parthasarathi
Mishra, Dibyajat
Sharma, Himani
Gandhi, Saumya
Sitaraman, Srikrishna
Tummala, Rao
NANOPACKAGING: FROM NANOMATERIALS TO THE ATOMIC SCALE, 2015, : 175 - 189
[40] Passive on-chip components for fully integrated silicon RF VCOs
Kyranas, Aristides
Papananos, Yannis
2002, Taylor and Francis Inc. (25)

← 1 2 3 4 5 →