Floorplet: Performance-Aware Floorplan Framework for Chiplet Integration

被引:0
|
作者
Chen, Shixin [1 ]
Li, Shanyi [1 ]
Zhuang, Zhen [1 ,2 ]
Zheng, Su [1 ]
Liang, Zheng
Ho, Tsung-Yi [1 ]
Yu, Bei [1 ]
Sangiovanni-Vincentelli, Alberto L. [2 ]
机构
[1] Chinese Univ Hong Kong, Dept Comp & Sci, Hong Kong, Peoples R China
[2] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
关键词
25-D integrated circuits (ICs); chiplet floorplanning; computer architecture; hardware/software co-design; DESIGN; DIE; TECHNOLOGY;
D O I
10.1109/TCAD.2023.3347302
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A chiplet is an integrated circuit (IC) that encompasses a well-defined subset of an overall system's functionality. In contrast to traditional monolithic system-on-chips (SoCs), chiplet-based architecture can reduce costs and increase reusability, representing a promising avenue for continuing Moore's law. Despite the advantages of multichiplet architectures, floorplan design in a chiplet-based architecture has received limited attention. Conflicts between cost and performance necessitate a tradeoff in chiplet floorplan design since additional latency introduced by advanced packaging can decrease performance. Consequently, balancing performance, cost, area, and reliability is of paramount importance. To address this challenge, we propose floorplan chiplet (Floorplet), a framework comprising simulation tools for performance reporting and comprehensive models for cost and reliability optimization. Our framework employs the open-source Gem5 simulator to establish the relationship between performance and floorplan for the first time, guiding the floorplan optimization of multichiplet architecture. The experimental results show that our method decreases interchiplet communication costs by 24.81%.
引用
收藏
页码:1638 / 1649
页数:12
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