4x4 Millimeter-Wave Patch Antenna Array for 5G Communication

被引：0
|
作者：
Yin, Ningning [1 ]
Chen, Tianfang [1 ]
Xu, Cheng [1 ]
Zhang, Hongwei [1 ]
Dai, Fengwei [1 ]
Sun, Peng [1 ]
机构：
[1] Natl Ctr Adv Packaging NCAP China, Wuxi, Jiangsu, Peoples R China
来源：
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2023年
关键词：
Antenna arrays; Millimeter-wave; Series-Fed Antennas; Antenna-in-Package(AiP); Fan-out wafer level packaging(FOWLP); PACKAGE;
D O I：
10.1109/ICEPT59018.2023.10492098
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Antenna-in-package(AiP) has been extensive used in millimeter wave(mm wave) system integration. Fan-out wafer level packaging (FOWLP) can improve electrical performance, reduce thickness and thermal resistance, making it become the best suited packaging for mm wave applications. This paper presented a 4x4 series fed patch antenna array which consists of four patch antennas fed by a 1-to-4 feeding network. The proposed antenna uses HFSS software for simulation, and this designed array showed a high gain directional wide side radiation pattern of 15.83 dBi at 28 GHz. The performance of the proposed array is adequate for 5G mm wave communication applications at 28
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页数：4
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