Wafer-scale 3D Integration of 2D Materials

被引：0
|
作者：
Das, Saptarshi [1 ]
机构：
[1] Penn State Univ, University Pk, PA 16802 USA
来源：
2024 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA | 2024年
关键词：
D O I：
10.1109/VLSITSA60681.2024.10546377
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页数：1
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