Ensuring advanced semiconductor device reliability using fa and submicron defect detection

被引：0
|
作者：
Gray, Doug [1 ]
Kendig, Dustin [1 ]
Tay, Andrew A.O. [2 ]
Shakouri, Ali [3 ]
机构：
[1] Microsanj LLC, Santa Clara,Calif, United States
[2] Singapore University of Technology and Design, Singapore
[3] Purdue University, West Lafayette,IN, United States
来源：
Electronic Device Failure Analysis | 2019年 / 21卷 / 01期
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