Thermal Materials for Packaging Power Electronics

被引：0
|
作者：
Misra, Sanjay [1 ]
机构：
[1] Henkel Adhesive Technologies, Chanhassen,MN,55317, United States
来源：
Advancing Microelectronics | 2020年 / 47卷 / 05期
关键词：
Packaging materials - Power electronics;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Thermal interface materials come in a variety of formats and performance attributes – the selection depends on the thermal and electrical insulation needs. In addition, one must consider manufacturability and automation in choosing the right TIM. © 2020 IMAPS-International Microelectronics and Packaging Society. All rights reserved.
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页码：16 / 19
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