Recent Development on Ultra-Low Firing Technologies of Microwave Dielectric Ceramics

被引:0
|
作者
Li X. [1 ]
Xue X. [1 ]
Wang H. [1 ,2 ]
Guo J. [1 ]
机构
[1] State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi'an Jiaotong University, Xi'an
[2] Department of Materials Science and Engineering, Southern University of Science and Technology, Guangdong, Shenzhen
关键词
ceramic; cold sintering process; low temperature co-fired ceramic; microwave dielectric; ultra-low sintering temperature technology; ultra-low temperature co-fired ceramic;
D O I
10.14062/j.issn.0454-5648.20220700
中图分类号
学科分类号
摘要
Microwave dielectric ceramics prepared via a conventional method usually require a high sintering temperature (i.e., >1 000 ℃) and long sintering time, leading to a high energy consumption and a difficulty to realize the integration and co-firing of multiple material system. Continuous innovation and development of wireless communication technology put forward higher requirements for the miniaturization and integration of microwave devices, so that some technologies for preparing low-temperature co-fired ceramic (LTCC) and ultralow-temperature co-fired ceramic (ULTCC) are developed. Developing green sintering technologies with lower sintering temperatures and higher sintering efficiencies becomes one of the research hotspots. Novel sintering technologies (i.e., liquid-phase sintering, hot press sintering, microwave sintering, spark plasma sintering, and flash sintering) promote the development of microwave dielectric ceramics. A novel ultra-low temperature sintering technology called cold sintering process is proposed. The sintering temperature of cold sintering process is rather low (≤300 ℃), which can densify ceramics in a short time, and has some advantages in the phase stability, co-firing of multiple materials and grain boundary manipulation, thus providing an opportunity for the development of ultra-low temperature sintering technology and microwave dielectric material system. © 2023 Chinese Ceramic Society. All rights reserved.
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页码:907 / 920
页数:13
相关论文
共 95 条
  • [61] GUO J, SI M M, ZHAO X T, Et al., Altering interfacial properties through the integration of C<sub>60</sub> into ZnO ceramic via cold sintering process[J], Carbon, 190, pp. 255-261, (2022)
  • [62] LI Y Q, ZHENG M P, ZANG M Y, Et al., Cold sintering co-firing of (Ca,Bi)(Mo,V)O<sub>4</sub>–PTFE composites in a single step[J], J Am Ceram Soc, 105, 10, pp. 6262-6270, (2022)
  • [63] GUO J, GUO H Z, HEIDARY D S B, Et al., Semiconducting properties of cold sintered V<sub>2</sub>O<sub>5</sub> ceramics and co-sintered V<sub>2</sub>O<sub>5</sub>–PEDOT: PSS composites[J], J Eur Ceram Soc, 37, 4, pp. 1529-1534, (2017)
  • [64] GUO J, LEGUM B, ANASORI B, Et al., Cold sintered ceramic nanocomposites of 2D MXene and zinc oxide[J], Adv Mater, 30, 32, (2018)
  • [65] SEO J H, VERLINDE K, GUO J, Et al., Cold sintering approach to fabrication of high rate performance binderless LiFePO<sub>4</sub> cathode with high volumetric capacity[J], Scripta Mater, 146, pp. 267-271, (2018)
  • [66] FAOURI S S, MOSTAED A, DEAN J S, Et al., High quality factor cold sintered Li<sub>2</sub>MoO<sub>4</sub>–BaFe<sub>12</sub>O<sub>19</sub> composites for microwave applications, Acta Mater, 166, pp. 202-207, (2019)
  • [67] GUO J, PFEIFFENBERGER N, BEESE A, Et al., Cold sintering Na<sub>2</sub>Mo<sub>2</sub>O<sub>7</sub> ceramic with poly (ether imide) (PEI) polymer to realize high-performance composites and integrated multilayer circuits, ACS Appl Nano Mater, 1, 8, pp. 3837-3844, (2018)
  • [68] DE BEAUVOIR T H, DURSUN S, GAO L S, Et al., New opportunities in metallization integration in cofired electroceramic multilayers by the cold sintering process[J], ACS Appl Electro Mater, 1, 7, pp. 1198-1207, (2019)
  • [69] GUO J, BERBANO S S, GUO H Z, Et al., Cold sintering process of composites: Bridging the processing temperature gap of ceramic and polymer materials[J], Adv Funct Mater, 26, 39, pp. 7115-7121, (2016)
  • [70] KANG Shenglin, ZHAO Xuetong, ZHANG Jiexin, Et al., Tran Chin Electrotech Soc (in Chinese), 37, 5, pp. 1098-1114, (2022)