Phase-field simulations of grain boundary grooving under diffusive-convective conditions

被引：0
|
作者：
Laxmipathy, V. Pavan [1 ,2 ]
Wang, Fei [1 ]
Selzer, Michael [1 ,2 ]
Nestler, Britta [1 ,2 ]
机构：
[1] Institute of Applied Materials (IAM-CMS), Karlsruhe Institute of Technology (KIT), Strasse am Forum 7, Karlsruhe,76131, Germany
[2] Institute of Digital Materials Science, Karlsruhe University of Applied Sciences, Moltkestr. 30, Karlsruhe,76133, Germany
来源：
Acta Materialia | 2021年 / 204卷
关键词：
Nanocrystals; -; Morphology;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Phase-field simulations of grain boundary grooving under diffusive-convective conditions
    Laxmipathy, V. Pavan
    Wang, Fei
    Selzer, Michael
    Nestler, Britta
    [J]. ACTA MATERIALIA, 2021, 204
  • [2] Phase-Field Modeling of Grain-Boundary Grooving Under Electromigration
    Mukherjee, Arnab
    Ankit, Kumar
    Mukherjee, Rajdip
    Nestler, Britta
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2016, 45 (12) : 6233 - 6246
  • [3] Phase-Field Modeling of Grain-Boundary Grooving Under Electromigration
    Arnab Mukherjee
    Kumar Ankit
    Rajdip Mukherjee
    Britta Nestler
    [J]. Journal of Electronic Materials, 2016, 45 : 6233 - 6246
  • [4] PHASE-FIELD SIMULATIONS OF BUBBLE GROWTH UNDER CONVECTIVE CONDITIONS
    Badillo, Arnoldo A.
    [J]. PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 8C, 2014,
  • [5] Grain boundary grooving in thin film under the influence of an external magnetic field: A phase-field study
    Bandyopadhyay, Soumya
    Bhowmick, Somnath
    Mukherjee, Rajdip
    [J]. Computational Materials Science, 2025, 246
  • [6] Grain boundary grooving in a polycrystalline thin film: A phase-field study
    Mukherjee, Rajdip
    Abinandanan, T. A.
    [J]. COMPUTATIONAL MATERIALS SCIENCE, 2022, 203
  • [7] THEORY OF GRAIN-BOUNDARY GROOVING IN THE CONVECTIVE-DIFFUSIVE REGIME
    RATKE, L
    VOGEL, HJ
    [J]. ACTA METALLURGICA ET MATERIALIA, 1991, 39 (05): : 915 - 923
  • [8] Phase-field modeling of grain-boundary grooving and migration under electric current and thermal gradient
    Chakraborty, Supriyo
    Kumar, Praveen
    Choudhury, Abhik
    [J]. ACTA MATERIALIA, 2018, 153 : 377 - 390
  • [9] Phase-field model for grain boundary grooving in multi-component thin films
    Bouville, Mathieu
    Hu, Shenyang
    Chen, Long-Qing
    Chi, Dongzhi
    Srolovitz, David J.
    [J]. MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2006, 14 (03) : 433 - 443
  • [10] Columnar dendritic solidification of TiAl under diffusive and hypergravity conditions investigated by phase-field simulations
    Viardin, A.
    Zollinger, J.
    Sturz, L.
    Apel, M.
    Eiken, J.
    Berger, R.
    Hecht, U.
    [J]. COMPUTATIONAL MATERIALS SCIENCE, 2020, 172
12345