Self-Heating Influence on Hot Carrier Degradation Reliability of GAA FET by 3D KMC Method

被引：0
|
作者：
Zhao, Songhan [1 ,2 ]
Zhao, Pan [1 ,2 ]
He, Yandong [1 ,2 ]
Du, Gang [1 ,2 ]
机构：
[1] Peking University, School of Integrated Circuits, Beijing,100871, China
[2] Beijing Advanced Innovation Center for Integrated Circuits, China
来源：
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD | 2023年
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学科分类号：
摘要：
Thermal gradients
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页码：101 / 104
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