Research Progress on Preparation Methods of High Thermal Conductivity Diamond/Copper Composites

Diamond/copper composites can be expected to solve the problems of packaging and heat dissipation of future high heat flux electronic component due to their high thermal conductivity. In this paper, the preparation methods of diamond/copper composites, the factors affecting thermal conductivity and interface problems are reviewed. Four main preparation processes, including hot pressing sintering, high temperature and high pressure sintering, spark plasma sintering and infiltration are summarized. It is pointed out that diamond particle parameters and sintering process parameters have important influence on the thermal conductivity of diamond/copper composites. And the bonding of diamond/copper interface can be strengthened by pre-metallization of diamond surface and copper matrix alloying. Moreover, the applications of diamond/copper are introduced. Finally, the development trend of diamond/copper composites in the future is proposed. © 2019, Editorial Office of FINE CHEMICALS. All right reserved.