Hybrid effect on mechanical and thermal performance of copper matrix composites reinforced with SiC whiskers

The rapid development of micro-electronics has a growing demand on the heat dissipation performance of devices, especially thermal management materials. However, recent researches focus on the improvement of single ability, such as thermal or mechanical properties. Herein, a strategy that simultaneously improves thermal and mechanical performance of thermal manager material was proposed, which was achieved by preparing Cu-SiC w composites via the co-electrodeposition technology. The influence of electroplating parameters, such as temperature, current density and reinforcement contents, on the microstructure evolution, mechanical and thermal conductivity were investigated systematically. The fabricated SiC w composite displayed excellent shear strength up to 420 MPa, which is resulted from the Orowan strengthening and load transferring. Additionally, the thermal conductivity of 340 W/(m & sdot; K) was obtained, owing to the uniform distribution of whiskers and good interface between the Cu matrix and whiskers. Therefore, the presented work provided an effective method for fabricating comprehensive thermal-mechanical properties and homogeneous heat dissipation capacity Cu-SiC w composites and paved the way for the practical application in the field of the connector between the power devices and heat sinks.