On optimizing the experimental setup for estimation of the thermal conductivity of thin films

被引:0
|
作者
Barragan, V. M. [1 ]
Pastuschuk, E. [1 ]
Maroto, J. C. [2 ,3 ]
Martin, A. [4 ]
Munoz, S. [1 ]
机构
[1] Univ Complutense Madrid, Dept Struct Matter Thermal Phys & Elect, Madrid, Spain
[2] Comillas Pontif Univ, Dept Elect Automat & Commun, Madrid, Spain
[3] Univ Europea Madrid, Dept Sci Comp & Technol, Madrid, Spain
[4] CSIC, Inst Phys & Informat Technol ITEFI, Madrid, Spain
关键词
Ion-exchange membranes; Thermal conductivity; Finite element Method; Contact resistance; SYSTEMS;
D O I
10.1007/s10973-024-13074-y
中图分类号
O414.1 [热力学];
学科分类号
摘要
The aim of this study is to show the optimal arrangement of a measurement system for estimating the thermal conductivity of thin films from temperature profiles. For this purpose, two different experimental setup systems, with square and circular cross sections, were designed to estimate the thermal conductivity of thin films and, in particular, of two ion exchange membranes. Both systems were placed horizontally and vertically in order to evaluate the best orientation to more accurately determine thermal conductivity. A three-dimensional numerical simulation was performed using Comsol Multiphysics to predict the heat flow and temperature gradient and to evaluate the effect of the geometry and the orientation on the contact resistances. Each system was first calibrated without the membrane inside in order to estimate all the necessary thermal properties of the different materials of the model. Next, the membrane was placed inside the model, so that the model now includes the thermal conductivity of the membrane as the only unknown parameter. The numerical results were compared with the various measured temperature profiles to estimate the thermal conductivity. The thermal conductivity values of the well-known Nafion 117 membrane and other thicker membrane were determined. A very good agreement with reliable literature values was obtained. The approach presented here, combining experimental and simulated temperature profiles, may provide the basis for a practical alternative to better estimate the thermal conductivity of thin films.
引用
收藏
页码:5799 / 5808
页数:10
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