Surface Modification of Polyimide Film by Dielectric Barrier Discharge at Atmospheric Pressure

被引：0
|
作者：
彭释 [1 ]
李灵均 [2 ]
李炜 [1 ]
王超梁 [2 ]
郭颖 [2 ,3 ]
石建军 [2 ,3 ]
张菁 [2 ,3 ]
机构：
[1] College of Textile,Donghua University
[2] Department of Applied Physics,Donghua University
[3] Member of Magnetic Confinement Fusion Research Center,Ministry of Education,Donghua
来源：
Plasma Science and Technology | 2016年 / 04期
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摘要：
In this paper,polyimide(PI)films are modified using an atmospheric pressure plasma generated by a dielectric barrier discharge(DBD)in argon.Surface performance of PI film and its dependence on exposure time from 0 s to 300 s are investigated by dynamic water contact angle(WCA),field emission scanning electron microscopy(FESEM),and Fourier transform infrared spectroscopy in attenuated total multiple reflection mode(FTIR-ATR).The study demonstrates that dynamic WCA exhibits a minimum with 40 s plasma treatment,and evenly distributed nano-dots and shadow concaves appeared for 40 s and 12 s Ar plasma treatment individually.A short period of plasma modification can contribute to the scission of the imide ring and the introduction of C-O and C=O(-COOH)by detailed analysis of FTIR-ATR.
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页数：5
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