Degradation of the front and back channels in a deep submicron partially depleted SOI NMOSFET under off-state stress

被引:0
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作者
郑齐文 [1 ,2 ,3 ]
余学峰 [1 ,2 ]
崔江维 [1 ,2 ]
郭旗 [1 ,2 ]
丛忠超 [1 ,2 ,3 ]
张兴尧 [1 ,2 ,3 ]
邓伟 [1 ,2 ,3 ]
张孝富 [1 ,2 ,3 ]
吴正新 [1 ,2 ,3 ]
机构
[1] Xinjiang Technical Institute of Physics&Chemistry,Chinese Academy of Sciences
[2] Xinjiang Key Laboratory of Electric Information Materials and Devices
[3] University of Chinese Academy of
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TN386 [场效应器件];
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摘要
<正>The hot-carrier effect charactenstic in a deep submicron partially depleted SOI NMOSFET is investigated. Obvious hot-carrier degradation is observed under off-state stress.The hot-carrier damage is supposed to be induced by the parasitic bipolar effects of a float SOI device.The back channel also suffers degradation from the hot carrier in the drain depletion region as well as the front channel.At low gate voltage,there is a hump in the sub-threshold curve of the back gate transistor,and it does not shift in the same way as the main transistor under stress.While under the same condition,there is a more severe hot-carrier effect with a shorter channel transistor. The reasons for those phenomena are discussed in detail.
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页码:91 / 96
页数:6
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