共 50 条
- [32] No flow underfill assembly process development for fine pitch flip chip silicon to silicon wafer level integration Advancing Microelectronics, 2010, 37 (04): : 20 - 25
- [33] Design of Stress Relief Groove on a Press-fitted Assembly MATERIALS PROCESSING AND MANUFACTURING III, PTS 1-4, 2013, 753-755 : 1339 - +
- [34] Customized assembly of insole for immediate pain relief in plantar warts INDIAN JOURNAL OF DERMATOLOGY VENEREOLOGY & LEPROLOGY, 2022, 88 (04): : 576 - 577
- [35] Relief Patterned-Tile Classification for Automatic Tessella Assembly TRENDS IN APPLIED INTELLIGENT SYSTEMS, PT I, PROCEEDINGS, 2010, 6096 : 368 - 377
- [38] A MODEL FOR THE PROCESS OF PLATE ETCHING FOR RELIEF PRINTING SOVIET ELECTROCHEMISTRY, 1982, 18 (04): : 433 - 436