The Relief of Eyestrain on a Fine Assembly Process

被引:0
|
作者
Mitchell, J. H.
机构
来源
HUMAN FACTOR-LONDON | 1936年 / 10卷 / 10期
关键词
D O I
暂无
中图分类号
B849 [应用心理学];
学科分类号
040203 ;
摘要
引用
收藏
页码:341 / 346
页数:6
相关论文
共 50 条
  • [1] Fine work and eyestrain.
    不详
    BRITISH MEDICAL JOURNAL, 1928, 1928 (01): : 1119 - 1120
  • [2] Advances in fine pitch lead free assembly process
    Doraiswami, R
    Sankararaman, S
    Kim, W
    Li, J
    Zhang, ZQ
    Gupta, P
    Nakanishi, K
    Borkar, M
    Madhavan, R
    Govind, V
    Choi, SN
    Aggarwal, AO
    Sun, Y
    Fan, LH
    Sundaram, V
    Swaminathan, M
    Wong, CP
    Tummala, RR
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 834 - 839
  • [3] Planning the delivery of relief supplies upon the occurrence of a natural disaster while considering the assembly process of the relief kits
    Rivera-Royero, Daniel
    Galindo, Gina
    Yie-Pinedo, Ruben
    SOCIO-ECONOMIC PLANNING SCIENCES, 2020, 69
  • [4] Human-machine cotlaboration system for fine assembly process
    Harada, Yutaka
    Nazir, Napoleon
    Shiote, Yoshinori
    Ito, Tomotaka
    2006 SICE-ICASE INTERNATIONAL JOINT CONFERENCE, VOLS 1-13, 2006, : 3490 - +
  • [5] Fine-tune relief calculations for supercritical fluids Improved process simulation assists with relief load and valve sizing
    Nezami, P.
    Price, J.
    HYDROCARBON PROCESSING, 2012, 91 (06): : 77 - +
  • [6] Advanced assembly process development for ultra fine pitch wafer level packaging
    Suh, Sungmin
    Baldwin, Daniel F.
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1038 - +
  • [7] A relief to the supersymmetric fine tuning problem
    Casas, JA
    Espinosa, JR
    Hidalgo, I
    STRING PHENOMENOLOGY 2003, 2004, : 76 - 85
  • [8] Assembly process development of 50um fine pitch wire bonded devices
    Yao, YF
    Xiong, ZP
    Gu, X
    Chua, KH
    Lin, TY
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 365 - 371
  • [9] Fine in the lab ≠ fine for the process
    Farnish, Richard
    TCE, 2008, (802): : 36 - 37
  • [10] Assembly process modeling for virtual assembly process planning
    Jun, Y
    Liu, JH
    Ning, RX
    Zhang, Y
    INTERNATIONAL JOURNAL OF COMPUTER INTEGRATED MANUFACTURING, 2005, 18 (06) : 442 - 451