共 50 条
- [2] Advances in fine pitch lead free assembly process 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 834 - 839
- [4] Human-machine cotlaboration system for fine assembly process 2006 SICE-ICASE INTERNATIONAL JOINT CONFERENCE, VOLS 1-13, 2006, : 3490 - +
- [5] Fine-tune relief calculations for supercritical fluids Improved process simulation assists with relief load and valve sizing HYDROCARBON PROCESSING, 2012, 91 (06): : 77 - +
- [6] Advanced assembly process development for ultra fine pitch wafer level packaging 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1038 - +
- [8] Assembly process development of 50um fine pitch wire bonded devices 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 365 - 371