THE INFLUENCE OF MASS-TRANSPORT ON THE DEPOSIT MORPHOLOGY AND THE CURRENT EFFICIENCY IN PULSE PLATING OF COPPER

被引：56
|
作者：
CHENE, O
LANDOLT, D
机构：
来源：
JOURNAL OF APPLIED ELECTROCHEMISTRY | 1989年 / 19卷 / 02期
关键词：
D O I：
10.1007/BF01062299
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
引用
收藏
页码：188 / 194
页数：7
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