TEST SOCKET GRABS INTEGRATED CIRCUIT LEADS

被引：0
|
作者：
BOGGS, RN
机构：
来源：
DESIGN NEWS | 1971年 / 26卷 / 09期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：46 / &
相关论文
共 50 条
  • [1] Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package
    Kim, Sangwon
    Lee, Junman
    Nam, Jaewoo
    Kim, Bonghwan
    Cho, Chanseob
    Kim, Jung Yup
    Choi, Hongsoo
    [J]. JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2014, 28 (07) : 2807 - 2814
  • [2] Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package
    Sangwon Kim
    Junman Lee
    Jaewoo Nam
    Bonghwan Kim
    Chanseob Cho
    Jung Yup Kim
    Hongsoo Choi
    [J]. Journal of Mechanical Science and Technology, 2014, 28 : 2807 - 2814
  • [3] INTEGRATED-CIRCUIT TEST STRUCTURES AND TEST METHODS
    LINHOLM, LW
    [J]. SOLID STATE TECHNOLOGY, 1981, 24 (09) : 67 - 67
  • [4] Test socket
    Anon
    [J]. Semiconductor International, 2001, 24 (06)
  • [5] CORROSION FAILURES OF INTEGRATED-CIRCUIT LEADS IN ELECTRONIC PACKAGES
    KRISHNASWAMY, P
    NATARAJAN, A
    LAKSHMANAN, TS
    SARKAR, BK
    [J]. TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS, 1982, 35 (01): : 74 - &
  • [6] THERMOCOMPRESSION BONDING OF EXTERNAL PACKAGE LEADS ON INTEGRATED CIRCUIT SUBSTRATES
    BOLCAR, VP
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1968, ED15 (09) : 651 - &
  • [7] THERMOCOMPRESSION BONDING OF EXTERNAL PACKAGE LEADS ON INTEGRATED CIRCUIT SUBSTRATES
    BOLCAR, VP
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1968, ED15 (06) : 421 - &
  • [8] ESD Damage Effect Test of Integrated Circuit
    Yang, Shiliang
    Li, Teng
    Pan, Hongliang
    Dai, Lin
    [J]. ADVANCES IN MECHATRONICS, AUTOMATION AND APPLIED INFORMATION TECHNOLOGIES, PTS 1 AND 2, 2014, 846-847 : 425 - 428
  • [9] AUTOMATED JOSEPHSON INTEGRATED CIRCUIT TEST SYSTEM
    Burroughs, C. J.
    Hamilton, C. A.
    [J]. IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 1993, 3 (01) : 2687 - 2689
  • [10] Research On Embedded Integrated Circuit Test System
    Zhang, Yifan
    Ma, Guojun
    Zhu, Jin
    Li, Mingze
    [J]. IEEE INTERNATIONAL CONFERENCE ON RECENT ADVANCES IN SYSTEMS SCIENCE AND ENGINEERING (IEEE RASSE 2021), 2021,
12345