INTER-DIFFUSION AND KIRKENDALL EFFECT IN CU-SN ALLOYS

被引：72

作者：

HOSHINO, K ^{[1
]}

IIJIMA, Y ^{[1
]}

HIRANO, KI ^{[1
]}

机构：

[1] TOHOKU UNIV,FAC ENGN,DEPT MAT SCI,SENDAI,MIYAGI 980,JAPAN

来源：

TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS | 1980年 / 21卷 / 10期

关键词：

D O I：

10.2320/matertrans1960.21.674

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

Interdiffusion coefficients in copper-rich copper-tin solid solutions containing up to 6 at% of Sn have been determined in the temperature range between 973 and 1101 K using semi-infinite couples with Kirkendall markers consisting of pure copper and Cu-Sn alloys. In addition the intrinsic diffusion coefficients in the alloys containing 0. 6, 1. 4, 2. 6 and 3. 5 at% Sn at 1089 K have been determined using finite thin plate couples.

引用

页码：674 / 682

页数：9

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