INTER-DIFFUSION AND KIRKENDALL EFFECT IN CU-SN ALLOYS

被引：72
|
作者：
HOSHINO, K [1 ]
IIJIMA, Y [1 ]
HIRANO, KI [1 ]
机构：
[1] TOHOKU UNIV,FAC ENGN,DEPT MAT SCI,SENDAI,MIYAGI 980,JAPAN
来源：
TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS | 1980年 / 21卷 / 10期
关键词：
D O I：
10.2320/matertrans1960.21.674
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
Interdiffusion coefficients in copper-rich copper-tin solid solutions containing up to 6 at% of Sn have been determined in the temperature range between 973 and 1101 K using semi-infinite couples with Kirkendall markers consisting of pure copper and Cu-Sn alloys. In addition the intrinsic diffusion coefficients in the alloys containing 0. 6, 1. 4, 2. 6 and 3. 5 at% Sn at 1089 K have been determined using finite thin plate couples.
引用
收藏
页码：674 / 682
页数：9
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