DEVELOPMENT OF COPPER WIRE BONDING APPLICATION TECHNOLOGY

被引：68

作者：

TOYOZAWA, K ^{[1
]}

FUJITA, K ^{[1
]}

MINAMIDE, S ^{[1
]}

MAEDA, T ^{[1
]}

机构：

[1] SHARP CO LTD,VLSI DEV LABS INTEGRATED CIRCUITS GRP,TENRI,NARA,JAPAN

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1990年 / 13卷 / 04期

关键词：

D O I：

10.1109/33.62577

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Continuous forming of oxide-free, stable, spherical copper balls has been realized by blowing a reducing gas over the copper wire during copper ball formation (sparking). Chip damage resulting from hard copper wire, including underpad crack and silicon cratering, has been a major technical hurdle to copper wire bonding. These problems have all been overcome by introducing the double load wire bonding technology. Unlike the conventional wire bonding technology, the double load wire bonding technology can minimize chip damage from wire bonding stress because the bonding load is decreased during ultrasonic power oscillation. Also, it was confirmed that copper wires have a reliability equivalent to that of gold wires. The double load wire bonding technology has allowed us to use copper wires in MOS LSI devices on a commercial basis. © 1990 IEEE

引用

页码：667 / 672

页数：6

共 50 条

[31] Wire Bonding Optimization with Fine Copper Wire for Volume Production
Yauw, Oranna
Clauberg, Horst
Lee, Kuan Fang
Shen, Liming
Chylak, Bob
[J]. 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 467 - 472
[32] INFLUENCES OF BONDING PARAMETERS ON THE TOOL WEAR FOR COPPER WIRE BONDING
Eichwald, Paul
Sextro, Walter
Althoff, Simon
Eacock, Florian
Schnietz, Mark
Guth, Karsten
Broekelmann, Michael
[J]. PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 669 - 672
[33] Development of Hybrid Bonding Wire
Kaimori, Shingo
Nonaka, Tsuyoshi
Mizoguchi, Akira
[J]. SEI Technical Review, 2006, (63): : 14 - 18
[34] PBGA wire bonding development
Shu, WK
[J]. 46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, : 219 - 225
[35] The wire sag problem in wire bonding technology for semiconductor packaging
Kung, Huang-Kuang
Chen, Hung-Shyong
Lu, Ming-Cheng
[J]. MICROELECTRONICS RELIABILITY, 2013, 53 (02) : 288 - 296
[36] Characteristics of copper-to-silicon diffusion in copper wire bonding
Zhang, Shawn X.
Lee, S. W. Ricky
Lau, A. K. M.
Tsang, P. P. H.
Mohamed, L.
Chan, C. Y.
Dirkzwager, M.
[J]. 2007 INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 2 - +
[37] Nanoindentation Investigation of Copper Bonding Wire and Ball
Fan, Xiangquan
Qian, Kaiyou
Wang, Techun
Cong, Yuqi
Zhao, Mike
Zhang, Binhai
Wang, Jiaji
[J]. 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 710 - +
[38] Alloyed Copper Bonding Wire with Homogeneous Microstructure
Murali, S.
Yeung, Johnny
Perez, Roman
[J]. 2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
[39] Cratering on thermosonic copper wire ball bonding
Tan Chee Wei
Abdul Razak Daud
[J]. Journal of Materials Engineering and Performance, 2002, 11 : 283 - 287
[40] The process optimization of EFO for copper wire bonding
Zhang, Wei
Lv, Xiaorui
Wang, Chunqing
[J]. ADVANCED COMPOSITE MATERIALS, PTS 1-3, 2012, 482-484 : 763 - +

← 1 2 3 4 5 →