ELECTRON-BEAM TECHNOLOGY FOR OPEN SHORT TESTING OF MULTICHIP SUBSTRATES

被引：14
|
作者：
GOLLADAY, SD
WAGNER, NA
RUDERT, JR
SCHMIDT, RN
机构：
[1] IBM General Tech Div, East Fishkill Fac, , NY
来源：
IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1990年 / 34卷 / 2-3期
关键词：
D O I：
10.1147/rd.342.0250
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
We discuss the need for noncontact electrical testing of high-performance multi-chip substrates and describe and electron-beam tester developed for this application. We describe the operational principles of the tester and compare and contrast its performance with that of mechanical probe testers. Finally, we discuss the motivations and technical issues involved in extending the electron-beam test method to future high-performance packages.
引用
收藏
页码：250 / 259
页数：10
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