COMPUTER-AIDED PROCESS PLANNING FOR TAPE AUTOMATED BONDING

被引：1
|
作者：
RAGHAVAN, S
SRIHARI, K
机构：
[1] Department Of Mechanical, Industrial Engineering T.J. Watson School of Engineering, Applied Science, Binghamton
来源：
COMPUTERS & INDUSTRIAL ENGINEERING | 1991年 / 21卷 / 1-4期
关键词：
D O I：
10.1016/0360-8352(91)90062-B
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
This paper describes the design and development of a knowledge based Computer Aided Process Planning (CAPP) system for Printed Circuit Board assembly. The domain considered uses both Surface Mount Technology (SMT) and Tape Automated Bonding (TAB) components. The structure and design of the CAPP system, and its inputs and outputs are discussed.
引用
收藏
页码：51 / 55
页数：5
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