SELECTION AND STRUCTURES OF LEAD-TIN EUTECTIC MONOGRAINS OBTAINED BY CONTROLLED SOLIDIFICATION

被引：9

作者：

FAVIER, JJ ^{[1
]}

LESOULT, G ^{[1
]}

机构：

[1] ECOLE MINES PARIS,CTR MAT,F-91003 EVRY,FRANCE

来源：

JOURNAL OF CRYSTAL GROWTH | 1977年 / 37卷 / 01期

关键词：

D O I：

10.1016/0022-0248(77)90146-4

中图分类号：

O7 [晶体学];

学科分类号：

0702 ; 070205 ; 0703 ; 080501 ;

摘要：

引用

页码：76 / 88

页数：13

共 50 条

[21] X-RAY STUDIES OF QUENCHED MELT OF LEAD-TIN EUTECTIC
KULMANEN, EV
PRESNYAKOV, AA
AUBAKIROVA, RK
DEGTYAREVA, AS
ZHUMARTBAYEVA, TV
FIZIKA METALLOV I METALLOVEDENIE, 1991, (11): : 112 - 116
[22] Compression testing of superplastic lead-tin eutectic alloy at room temperature
Soliman, MS
Al-Seif, KA
ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING, 2005, 30 (2B): : 177 - 188
[23] Fatigue-creep interactions in a eutectic lead-tin solder alloy
Plumbridge, WJ
ENGINEERING AGAINST FATIGUE, 1999, : 539 - 545
[24] CALORIMETRIC ASPECTS OF PROXIMITY EFFECT IN LAMELLAR LEAD-TIN EUTECTIC ALLOYS
LECHEVET, J
SHIFFMAN, CA
NEIGHBOR, JE
BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1971, 16 (04): : 497 - &
[25] AN EXPERIMENTAL INVESTIGATION OF UNDERCOOLING AT SOLID/LIQUID INTERFACE OF LEAD-TIN EUTECTIC
HUNT, JD
CHILTON, JP
JOURNAL OF THE INSTITUTE OF METALS, 1963, 92 (01): : 21 - &
[26] DETERMINATION OF LEAD AND TIN IN LEAD-TIN SOLDER ALLOYS BY CONTROLLED-POTENTIAL ELECTROYLSIS
ALFONSI, B
ANALYTICA CHIMICA ACTA, 1960, 23 (04) : 375 - 380
[27] OBSERVATIONS OF STRAIN RATE TRANSIENTS IN THE SUPERPLASTIC LEAD-TIN EUTECTIC ALLOY
ALDEN, TH
SCRIPTA METALLURGICA, 1987, 21 (06): : 735 - 738
[28] EFFECT OF SMALL ADDITIONS OF SILVER ON THE EUTECTIC TEMPERATURE IN THE LEAD-TIN SYSTEM
TARBY, SK
NOTIS, MR
METALLURGICAL TRANSACTIONS B-PROCESS METALLURGY, 1986, 17 (04): : 829 - 832
[29] Experimental Investigation of Macrosegregation During Vertical Solidification of Lead-Tin Alloys
Singh, Amarendra K.
Basu, Biswajit
Ghosh, Ahindra
TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS, 2012, 65 (01) : 85 - 96
[30] Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
Kang, SK
Rai, RS
Purushothaman, S
JOURNAL OF ELECTRONIC MATERIALS, 1996, 25 (07) : 1113 - 1120

← 1 2 3 4 5 →