SPECIAL ISSUE ON THE 13TH EUROPEAN SOLID-STATE CIRCUITS CONFERENCE - FOREWORD

被引：0

作者：

HOEFFLINGER, B ^{[1
]}

KLAR, H ^{[1
]}

机构：

[1] TECH UNIV BERLIN,INST MICROELECTR,D-1000 BERLIN 12,FED REP GER

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1988年 / 23卷 / 03期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：619 / 620

页数：2

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