共 50 条
- [21] CLAY CERAMIC INCORPORATED WITH GRANITE WASTE OBTAINED FROM DIAMOND MULTI-WIRE SAWING TECHNOLOGY 20TH BRAZILIAN CONFERENCE ON MATERIALS SCIENCE AND ENGINEERING, 2014, 775-776 : 648 - +
- [22] Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw ENGINEERING SCIENCE AND TECHNOLOGY-AN INTERNATIONAL JOURNAL-JESTECH, 2020, 23 (05): : 1100 - 1108
- [23] Volume abrasive wear of SiC in multi-wire sawing process Taiyangneng Xuebao/Acta Energiae Solaris Sinica, 2019, 40 (03): : 791 - 796
- [24] Investigation on the stiffness of wire web of multi-wire sawing machine and its influence on machining accuracy INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2021, 117 (3-4): : 985 - 995
- [25] Investigation on the stiffness of wire web of multi-wire sawing machine and its influence on machining accuracy The International Journal of Advanced Manufacturing Technology, 2021, 117 : 985 - 995
- [28] A basic study on the behavior of slurry action at multi-wire saw ADVANCES IN ABRASIVE TECHNOLOGY V, 2003, 238-2 : 89 - 92
- [29] Depth of cut per abrasive in fixed diamond wire sawing INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2015, 80 (5-8): : 1337 - 1346
- [30] Depth of cut per abrasive in fixed diamond wire sawing The International Journal of Advanced Manufacturing Technology, 2015, 80 : 1337 - 1346