THIN-FILM LUMPED-ELEMENT MICROWAVE INTEGRATED CIRCUITS

被引：0
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作者：
BAILEY, WL
KLEPPINGER, RE
机构：
来源：
PROCEEDINGS ELECTRONIC COMPONENTS CONFERENCE | 1970年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：497 / +
页数：1
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