Coping with Poor Dynamic Performance of Super-Junction MOSFET Body Diodes

被引:5
|
作者
Pavlovsky, Martin [1 ]
Guidi, Giuseppe [1 ]
Kawamura, Atsuo [1 ]
机构
[1] Yokohama Natl Univ, Hodogaya Ku, 79-5,Tokiwadai, Yokohama, Kanagawa 2408501, Japan
关键词
superjunction MOSFET; body diode; reverse recovery; forward recovery; soft switching;
D O I
10.1541/ieejjia.2.183
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Poor dynamic performance of body diodes in Super Junction MOSFETs may cause difficulties when utilised in high frequency conversion circuits. Excessive reverse recovery as well as forward recovery may in the best case result in high conversion losses and EMI pollution where as in the worst case they may completely disrupt the converter operation. In this paper, using an auxiliary snubber circuit to control the reverse recovery and connecting a fast diode in parallel to a super junction switch to reduce the forward recovery is proposed. As documented by numerous experimental results, both proposed concepts work well and both recoveries may be largely avoided. Implementation of the proposed concepts in a forward boost, reverse buck circuit resulted in efficiencies close to 98.5% in 3-12.5 kW load range while operating at 62.5 kHz.
引用
收藏
页码:183 / 188
页数:6
相关论文
共 50 条
  • [41] Design of non-uniform 100-V super-junction trench power MOSFET with low on-resistance
    Lho, Young Hwan
    Yang, Yil-Suk
    IEICE ELECTRONICS EXPRESS, 2012, 9 (13): : 1109 - 1114
  • [42] On the super-junction formed by using field plate for lateral AlGaN/GaN-based Schottky barrier diodes
    Wang, Zhizhong
    Huang, Fuping
    Chu, Chunshuang
    Zhang, Yonghui
    Sun, Qian
    Zhang, Zi-Hui
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2023, 62 (09)
  • [43] Analysis of breakdown voltage and on resistance of super-junction power MOSFET CoolMOS™ using theory of novel voltage sustaining layer
    Kondekar, PN
    Parikh, CD
    Patil, MB
    PESC'02: 2002 IEEE 33RD ANNUAL POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-4, CONFERENCE PROCEEDINGS, 2002, : 1769 - 1775
  • [44] Industrial 650V 4-Pack Super-Junction MOSFET Module using Transfer Molding Process
    Lim, Jangmuk
    Seong, Jihwan
    Yoon, Sang Won
    Kim, You Suk
    Im, Hun-Chang
    Hong, Won Sik
    2019 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2019, : 4097 - 4101
  • [45] Fabrication and Optimization of a High-Reliability 700 V Super-Junction MOSFET with Segmented P-Buried RESURF Termination
    Yao, Guoliang
    Qiao, Ming
    Shi, Zesheng
    Li, Jue
    Zhang, Bo
    2024 36TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND IC S, ISPSD 2024, 2024, : 48 - 51
  • [46] Super-Junction Power MOSFET in Half Bridge DC-DC Zero-Voltage Converter for Energy Conversion Management
    Musumeci, S.
    Cristaldi, D.
    Portoghese, F.
    2015 INTERNATIONAL CONFERENCE ON CLEAN ELECTRICAL POWER (ICCEP), 2015, : 755 - 760
  • [47] High Performance CMOS-compatible Super-junction FINFETs for Sub-100V Applications
    Yoo, Abraham
    Ng, Jacky C. W.
    Sin, Johnny K. O.
    Ng, Wai Tung
    2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST, 2010,
  • [48] A High-Efficiency Super-Junction MOSFET based Inverter-Leg Configuration using a Dual-Mode Switching Technique
    Feng, Zhengyang
    McNeill, Neville
    Williams, Barry
    THIRTY-FOURTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2019), 2019, : 2467 - 2474
  • [49] Novel High-Tolerance Termination With Resistive Field Plate for 600 V Super-Junction Vertical Double-Diffused MOSFET
    Wang, Ruidi
    Qiao, Ming
    Wang, Yibing
    Li, Zhaoji
    Zhang, Bo
    IEEE ELECTRON DEVICE LETTERS, 2022, 43 (07) : 1093 - 1096
  • [50] A Novel Super-junction Trench Gate MOSFET Fabricated Using High Aspect-ratio Trench Etching and Boron Lateral Diffusion Technologies
    Kim, S. G.
    Park, H. S.
    Yoo, S. W.
    Na, K. I.
    Koo, J. G.
    Won, J. I.
    Park, K. S.
    Yang, Y. S.
    Lee, J. H.
    2013 25TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2013, : 233 - 236