THE STRUCTURE OF THE EUTECTIC PB/SN ALLOY FILM PREPARED BY A MELTING METHOD

被引：0
|
作者：
TAKAHASHI, N
ASHINUMA, K
机构：
来源：
JOURNAL OF ELECTRON MICROSCOPY | 1958年 / 6卷
关键词：
D O I：
暂无
中图分类号：
TH742 [显微镜];
学科分类号：
摘要：
引用
收藏
页码：29 / 33
页数：5
相关论文
共 50 条
  • [41] The effect of ball milling on the melting behavior of Sn-Cu-Ag eutectic alloy
    Reddy, Bhupal
    Bhattacharya, P.
    Singh, Bawa
    Chattopadhyay, K.
    JOURNAL OF MATERIALS SCIENCE, 2009, 44 (09) : 2257 - 2263
  • [42] Evolution of structure unidirectionally solidified Sn-Ag3Sn eutectic alloy
    Esaka, H
    Shinozuka, K
    Tamura, M
    MATERIALS TRANSACTIONS, 2005, 46 (05) : 916 - 921
  • [43] Impact of In element on the melting point and properties of Pb-56Bi-In eutectic alloy
    Luo, Fang
    Huang, Feihong
    Hu, Jinxin
    Yang, Youdong
    MODERN PHYSICS LETTERS B, 2025, 39 (06):
  • [44] Melting and solidification behavior of Pb–Sn embedded alloy nano-particles
    Patan Yousaf Khan
    Victoria Bhattacharya
    Krishanu Biswas
    Kamanio Chattopadhyay
    Journal of Nanoparticle Research, 2013, 15
  • [45] Research on lamellar structure and microhardness in directionally solidified ternary Sn-40.5Pb-2.6Sb eutectic alloy
    Hu, X. W.
    Li, S. M.
    Gao, S. F.
    Liu, L.
    Fu, H. Z.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 493 (1-2) : 116 - 121
  • [46] MICROSTRUCTURE OF Ti - Mo - Zr - Ta - Sn ALLOY PREPARED BY PLASMA MELTING
    Losertova, Monika
    Ijaz, Farzik M.
    Drapala, Jaromir
    Stencek, Michel
    Kubes, Vojtech
    Skoda, Jan
    Petlak, Daniel
    Konecna, Katerina
    28TH INTERNATIONAL CONFERENCE ON METALLURGY AND MATERIALS (METAL 2019), 2019, : 1498 - 1503
  • [47] STUDY OF SUPERPLASTICITY IN PB-SN EUTECTIC ALLOY USING IMPRESSION CREEP TECHNIQUE
    SHETTIGAR, S
    RAO, PP
    INDIAN JOURNAL OF ENGINEERING AND MATERIALS SCIENCES, 1994, 1 (03) : 161 - 164
  • [48] THERMIC CURVES IN ORIENTED CRYSTALLIZATION OF AN EUTECTIC SN-PB ALLOY AND OF PURE TIN
    FRANEK, A
    KUBICEK, L
    FRANEK, A
    KOVOVE MATERIALY-METALLIC MATERIALS, 1988, 26 (02): : 164 - 172
  • [49] Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloy
    Noboru Wade
    Tatsuo Akuzawa
    Seiji Yamada
    Daigo Sugiyama
    Ick-Soo Kim
    Kazuya Miyahara
    Journal of Electronic Materials, 1999, 28 : 1286 - 1289
  • [50] Creep behavior and deformation mechanism map of Sn-Pb eutectic solder alloy
    Shi, XQ
    Wang, ZP
    Yang, QJ
    Pang, HLJ
    JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, 2003, 125 (01): : 81 - 88
12345