Magnetization and thermal EMF's

被引:1
|
作者
Williams, SR [1 ]
机构
[1] Yale Univ, New Haven, CT USA
来源
PHYSICAL REVIEW | 1932年 / 39卷 / 02期
关键词
D O I
10.1103/PhysRev.39.368
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
引用
收藏
页码:368 / 371
页数:4
相关论文
共 50 条
  • [41] THERMAL EMF AND THERMOMAGNETIC PROPERTIES OF BISMUTH AT LOW TEMPERATURES
    KORENBLIT, IY
    KUSNETSO.ME
    SHALYT, SS
    SOVIET PHYSICS JETP-USSR, 1969, 29 (01): : 4 - +
  • [42] ANOMALIES OF THERMAL EMF IN PHONON-PHONON DRAGGING
    KOZLOV, VA
    NAGAEV, EL
    JETP LETTERS-USSR, 1971, 13 (11): : 455 - &
  • [43] Electron thermal EMF for NaxCu2-xS
    Kuterbekov, Kairat
    Balapanov, Malik
    Ishembetov, Rais
    Kubenova, Marzhan
    Baitasov, Talgat
    Kabyshev, Asset
    Azhibekov, Aidos
    Kenzhebatyr, Bekmyrza
    Alibay, Temirulan
    INTERNATIONAL CONFERENCE ON ADVANCES IN ENERGY SYSTEMS AND ENVIRONMENTAL ENGINEERING (ASEE17), 2017, 22
  • [44] LOW THERMAL EMF REED RELAYS IN PROCESS ENGINEERING
    BROWN, P
    CONTROL AND INSTRUMENTATION, 1981, 13 (07): : 53 - 53
  • [45] Thermal EMF of Tm1-xSmxS system
    Popov, VV
    Smirnov, IA
    Golubkov, AV
    Parfeneva, LS
    Kasymova, AG
    FIZIKA TVERDOGO TELA, 1996, 38 (05): : 1505 - 1510
  • [46] Thermal EMF and electroresistance of CuO monocrystals at high pressures
    Shchennikov, VV
    Gizhevskii, BA
    Samokhvalov, AA
    Naumov, SV
    ZHURNAL TEKHNICHESKOI FIZIKI, 1995, 65 (12): : 132 - 135
  • [47] DEVICE FOR MEASURING THERMAL EMF OF SEMICONDUCTOR-MATERIALS
    LYASHCHENOK, VI
    PLEKHOTKINA, GL
    STREKOPYTOVA, NI
    INSTRUMENTS AND EXPERIMENTAL TECHNIQUES, 1976, 19 (05) : 1568 - 1569
  • [48] Thermal emf in a bipolar semiconductor with phonon drag of carriers
    A. Konin
    R. Raguotis
    Semiconductors, 2000, 34 : 1052 - 1053
  • [49] THE BARRIER THERMAL EMF AT A P-N-JUNCTION
    BALMUSH, II
    DASHEVSKII, ZM
    KASIYAN, AI
    SEMICONDUCTORS, 1995, 29 (10) : 937 - 941
  • [50] ADSORPTION AND THERMAL EMF DURING THE MELTING OF BISMUTH ALLOYS
    KUCHERENKO, ES
    RUSSIAN METALLURGY, 1989, (04): : 45 - 49