OVERLAY CONSIDERATIONS FOR THE SELECTION OF INTEGRATED-CIRCUIT PATTERN-LEVEL SEQUENCES

被引：0

作者：

KOPP, RJ ^{[1
]}

STEVENS, DJ ^{[1
]}

机构：

[1] GCA CORP,BEDFORD,MA

来源：

SOLID STATE TECHNOLOGY | 1980年 / 23卷 / 07期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：79 / 87

页数：9

共 14 条

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[J]. IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 1972, IA 8 (06) : 697 - 706
[2] A TEST PATTERN FOR THE EVALUATION OF BIPOLAR INTEGRATED-CIRCUIT PROCESSES
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[3] USE OF CASSETTE RECORDERS IN INTEGRATED-CIRCUIT CHIP SELECTION.
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[4] INTEGRATED-CIRCUIT SYSTEM FOR CHANNEL SELECTION OF VARACTOR TUNED TELEVISION RECEIVERS
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[J]. IEEE TRANSACTIONS ON BROADCAST AND TELEVISION RECEIVERS, 1974, BT20 (03): : 235 - 246
[5] SOME CONSIDERATIONS IN THE USE OF QUALITY-CONTROL TECHNIQUES IN INTEGRATED-CIRCUIT FABRICATION
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[J]. INTERNATIONAL STATISTICAL REVIEW, 1993, 61 (01) : 97 - 107
[6] SEMICUSTOM INTEGRATED-CIRCUIT AMPLIFIER AND LEVEL DISCRIMINATOR FOR NUCLEAR AND SPACE INSTRUMENTS
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CAFFERTY, MM
[J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1991, 38 (02) : 44 - 49
[7] Pattern and polarization measurements of integrated-circuit spiral antennas at 10 mu m wavelength
MacDonald, ME
Grossman, EN
[J]. MILLIMETER AND SUBMILLIMETER WAVES III, 1996, 2842 : 501 - 512
[8] MICRO-ELECTRONIC TEST PATTERN FOR MEASURING UNIFORMITY OF AN INTEGRATED-CIRCUIT FABRICATION TECHNOLOGY
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REIMANN, CT
MAXWELL, DB
BUEHLER, MG
[J]. SOLID STATE TECHNOLOGY, 1979, 22 (02) : 71 - 74
[9] Frequency-band selection for an integrated-circuit package antenna using LTCC technology
Wang, JJ
Xue, Y
Zhang, YP
Chua, KM
Lu, ACW
Wai, LL
Wong, CK
[J]. MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2005, 44 (05) : 439 - 441
[10] FAILURE PATTERN DETERMINATION FOR INTEGRATED-CIRCUIT DEVICES USING WET-CHEMICAL DECAPSULATION AND STATISTICAL RELIABILITY MODELING
BARRY, DM
CHRYSANTHOU, C
WEIR, NA
[J]. RELIABILITY ENGINEERING & SYSTEM SAFETY, 1986, 15 (04) : 283 - 298

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