ELECTROMIGRATION IN THIN GOLD FILMS

被引：39
|
作者：
KLEIN, BJ [1 ]
机构：
[1] CNRS,LAB PHYS MAT,BELLEVUE 92,FRANCE
来源：
JOURNAL OF PHYSICS F-METAL PHYSICS | 1973年 / 3卷 / 04期
关键词：
D O I：
10.1088/0305-4608/3/4/010
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页码：691 / &
相关论文
共 50 条
  • [31] ELECTROMIGRATION IN GOLD AND COPPER THIN-FILM CONDUCTORS
    MILLER, RJ
    GANGULEE, A
    THIN SOLID FILMS, 1980, 69 (03) : 379 - 386
  • [32] Anelasticity study on electromigration effect in Cu thin films
    Mizubayashi, H.
    Goto, K.
    Ebisawa, T.
    Tanimoto, H.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 442 (1-2): : 342 - 346
  • [33] VOID FORMATION AND GROWTH DURING ELECTROMIGRATION IN THIN FILMS
    ROSENBER.R
    OHRING, M
    JOURNAL OF APPLIED PHYSICS, 1971, 42 (13) : 5671 - &
  • [34] ELECTROMIGRATION AND DIFFUSION IN THIN-FILMS - NEW TECHNIQUE
    BENIERE, F
    REDDY, KV
    KOSTOPOULOS, D
    LETRAON, JY
    JOURNAL OF APPLIED PHYSICS, 1978, 49 (05) : 2743 - 2747
  • [35] Vacancy model for threshold electromigration in thin metallic films
    Aleshin, AN
    Shvindlerman, LS
    DIFFUSIONS IN MATERIALS: DIMAT2000, PTS 1 & 2, 2001, 194-1 : 55 - 60
  • [36] ELECTROMIGRATION TESTING OF THIN-FILMS AT THE WAFER LEVEL
    TOWNER, JM
    SOLID STATE TECHNOLOGY, 1984, 27 (10) : 197 - 200
  • [37] MARKER MOTION DURING ELECTROMIGRATION IN THIN-FILMS
    OHRING, M
    SUN, PH
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01): : 284 - &
  • [38] EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS
    DHEURLE, FM
    METALLURGICAL TRANSACTIONS, 1971, 2 (03): : 683 - &
  • [39] ELECTROMIGRATION TESTING OF THIN FILMS AT THE WAFER LEVEL.
    Towner, Janet M.
    1600, (27):
  • [40] TRACER STUDY OF DIFFUSION AND ELECTROMIGRATION IN THIN TIN FILMS
    SINGH, P
    OHRING, M
    JOURNAL OF APPLIED PHYSICS, 1984, 56 (04) : 899 - 907
12345