Adhesion of MOCVD TiO2 thin films

被引：0
|
作者：
Kandasamy, I. [1 ]
Gawne, D. T. [1 ]
机构：
[1] Univ W London, Dept Mat Technol, Uxbridge UB8 3PH, Middx, England
来源：
JOURNAL OF PHYSICS D-APPLIED PHYSICS | 1988年 / 21卷 / 10期
关键词：
D O I：
10.1088/0022-3727/21/10S/021
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
An experimental technique for the assessment of the adhesion of transparent films is presented based on the measurement of subcritical interfacial cracks in the indentation and scratch tests. The results show that the interfacial crack size is associated with the Young's modulus to hardness ratio of the substrate and that the mechanical behaviour of the substrate during testing must be taken into consideration for the determination of the true adhesion.
引用
收藏
页码：S75 / S77
页数：3
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