JOINING OF SILICON-NITRIDE USING GLASS SOLDERS

被引：0
|
作者：
IWAMOTO, N
KAMAI, M
OHNISHI, K
INOUE, H
FUJII, K
UESAKA, SY
USUI, I
机构：
[1] SAGA PREFECTURAL GOVT,IND RES INST,SAGA 84001,JAPAN
[2] OSAKA UNIV,GRAD SCH,SUITA,OSAKA 565,JAPAN
来源：
ISIJ INTERNATIONAL | 1990年 / 30卷 / 12期
关键词：
SILICON NITRIDE; JOINING; GLASS SOLDER;
D O I：
10.2355/isijinternational.30.1119
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
It is well known that segregation of Ti and formation of TiN occurs when active brazing alloys such as Ag-Cu-Ti were used for Si3N4 joining. Si3N4-Si3N4 joining was carried out using several glass solders containing oxides of active metal, 1A group elements and 2A group elements without applying pressure. Si3N4-glass reaction and bonding behavior of these elements in Si3N4-Si3N4 joint were studied. The bonding strength obtained from Silicon nitride joints using glass solder in the system SiO2-Al2O3-Li2O was strong enough for practical application.
引用
收藏
页码：1119 / 1123
页数：5
相关论文
共 50 条
  • [21] SILICON-NITRIDE
    AULT, NN
    YECKLEY, RL
    AMERICAN CERAMIC SOCIETY BULLETIN, 1992, 71 (05): : 816 - 816
  • [22] OXIDATION OF SILICON-NITRIDE FILMS COVERED WITH PHOSPHOSILICATE GLASS
    ALEKSIEVA, TI
    DOKLADI NA BOLGARSKATA AKADEMIYA NA NAUKITE, 1984, 37 (08): : 1031 - 1033
  • [23] SILICON-NITRIDE
    不详
    ENGINEERING MATERIALS AND DESIGN, 1977, 21 (08): : 21 - 23
  • [24] SILICON-NITRIDE
    AULT, NN
    AMERICAN CERAMIC SOCIETY BULLETIN, 1991, 70 (05): : 882 - 883
  • [25] JOINING OF SILICON-NITRIDE TO SUS304 STAINLESS-STEEL USING A SPUTTERING METHOD
    SUEYOSHI, H
    TABATA, M
    NAKAMURA, Y
    TANAKA, R
    JOURNAL OF MATERIALS SCIENCE, 1992, 27 (07) : 1926 - 1932
  • [26] SILICON NITRIDE JOINING WITH SILICATE GLASS SOLDER (I).
    Iwamoto, Nobuya
    Umesaki, Norimasa
    Haibara, Yukio
    1600, (15):
  • [27] STRUCTURE OF SILICON-NITRIDE FILMS .2. NONSTOICHIOMETRIC SILICON-NITRIDE
    EDELMAN, FL
    ZAITSEV, BN
    LATUTA, VZ
    KHOROMENKO, AA
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1979, 51 (01): : 49 - 56
  • [28] EFFECT OF PRE-HEAT-TREATMENT ON SILICON-NITRIDE JOINING WITH ALUMINUM BRAZE
    MORITA, M
    SUGANUMA, K
    OKAMOTO, T
    JOURNAL OF MATERIALS SCIENCE LETTERS, 1987, 6 (04) : 474 - 476
  • [29] SIMS ANALYSIS OF THE JOINING INTERFACE BETWEEN SILICON-NITRIDE AND METAL USING A CESIUM ION-SOURCE
    SHICHI, Y
    INOUE, Y
    MATSUNAGA, M
    BUNSEKI KAGAKU, 1990, 39 (07) : T93 - T98
  • [30] SILICON-NITRIDE STAINLESS-STEEL BRAZE JOINING WITH AN ACTIVE FILLER METAL
    XU, R
    INDACOCHEA, JE
    JOURNAL OF MATERIALS SCIENCE, 1994, 29 (23) : 6287 - 6294
12345