共 50 条
- [21] Subsurface damage reduction of ground silicon wafers PRECISION ENGINEERING, NANOTECHNOLOGY, VOL. 2, 1999, : 511 - 514
- [22] SURFACE GRINDING METHOD OF SILICON WAFERS ANNALS OF DAAAM FOR 2008 & PROCEEDINGS OF THE 19TH INTERNATIONAL DAAAM SYMPOSIUM, 2008, : 395 - 396
- [24] Charged defects at the interface between directly bonded silicon wafers JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1997, 36 (9A): : 5502 - 5506
- [30] Impact of chemical and epitaxial treatment on surface defects on silicon wafers DEFECTS IN ELECTRONIC MATERIALS II, 1997, 442 : 137 - 142