HIGH THERMAL-CONDUCTIVITY ALUMINUM NITRIDE IN ADVANCED PACKAGING APPLICATIONS

被引：0
|
作者：
KAMP, AJ
PAQUETTE, MS
KNUDSEN, AK
KHOURY, IA
SCANLON, KL
机构：
来源：
PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2 | 1989年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：944 / 946
页数：3
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