MICROMINIATURE ELECTRONIC THERMAL SENSING DEVICES

被引:0
|
作者
DELANEY, RA
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:380 / &
相关论文
共 50 条
  • [31] A Review on Thermal Properties of Hydrogels for Electronic Devices Applications
    Xin, Fei
    Lyu, Qiang
    GELS, 2023, 9 (01)
  • [32] THERMAL IMAGING OF ELECTRONIC DEVICES WITH LOW SURFACE EMISSIVITY
    WEBB, PW
    IEE PROCEEDINGS-G CIRCUITS DEVICES AND SYSTEMS, 1991, 138 (03): : 390 - 400
  • [33] Present and future thermal interface materials for electronic devices
    Razeeb, Kafil M.
    Dalton, Eric
    Cross, Graham Lawerence William
    Robinson, Anthony James
    INTERNATIONAL MATERIALS REVIEWS, 2018, 63 (01) : 1 - 21
  • [34] Thermal imaging and measurement techniques for electronic materials and devices
    Kolzer, J
    Oesterschulze, E
    Deboy, G
    MICROELECTRONIC ENGINEERING, 1996, 31 (1-4) : 251 - 270
  • [35] Thermal analysis of nanoscale electronic devices by spectral methods
    Coskun, AU
    Ilegbusi, OJ
    Yener, Y
    CHT'01: ADVANCES IN COMPUTATIONAL HEAT TRANSFER II, VOLS 1 AND 2, PROCEEDINGS, 2001, : 913 - 920
  • [36] Thermal Design of Electronic Devices with a Forced Cooling System
    Shilo, Galina
    Beskorovainyi, Vladimir
    Ogrenich, Evgen
    Furmanova, Nataliia
    Myronova, Natalia
    PROCEEDINGS OF THE 2019 10TH IEEE INTERNATIONAL CONFERENCE ON INTELLIGENT DATA ACQUISITION AND ADVANCED COMPUTING SYSTEMS - TECHNOLOGY AND APPLICATIONS (IDAACS), VOL. 1, 2019, : 556 - 561
  • [37] Electronic devices engineered to dissolve and disintegrate by thermal triggering
    Liu, YuHao
    MRS BULLETIN, 2015, 40 (08) : 626 - 627
  • [38] Thermal Management on IGBT Power Electronic Devices and Modules
    Qian, Cheng
    Gheitaghy, Amir Mirza
    Fan, Jiajie
    Tang, Hongyu
    Sun, Bo
    Ye, Huaiyu
    Zhang, Guoqi
    IEEE ACCESS, 2018, 6 : 12868 - 12884
  • [39] Thermal Management of Electronic and Electrical Devices in Automobile Environment
    Nakayama, Wataru
    Suzuki, Osamu
    Hara, Yoshikatsu
    2009 IEEE VEHICLE POWER AND PROPULSION CONFERENCE, VOLS 1-3, 2009, : 541 - 548
  • [40] Thermal ink jet printing of electronic materials and devices
    Punsalan, D
    Thompson, J
    Mardilovich, P
    Betrabet, C
    Hoffman, R
    Herman, G
    Lindner, T
    Digital Fabrication 2005, Final Program and Proceedings, 2005, : 128 - 130