MACRO ASSEMBLY-COMPLEX MULTI-CHIP LSI

被引：0
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作者：
BADER, RF
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来源：
PROCEEDINGS ELECTRONIC COMPONENTS CONFERENCE | 1969年
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：178 / &
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