共 50 条
- [31] The effect of impurities on the formation of the inner porous layer in the Cu2O scale during copper oxidation OXIDATION OF METALS, 2004, 61 (3-4): : 293 - 301
- [34] EFFECT OF ANNEALING TEMPERATURE ON SUBGRAIN GROWTH DURING RECOVERY IN OXYGEN-FREE HIGH CONDUCTIVITY COPPER MATERIALS SCIENCE AND ENGINEERING, 1988, 100 : L15 - L18
- [36] The Effect of Impurities on the Formation of the Inner Porous Layer in the Cu2O Scale During Copper Oxidation Oxidation of Metals, 2004, 61 : 293 - 301
- [37] The role of orientation pinning in statically recrystallized oxygen-free high-conductivity copper wire METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2005, 36A (01): : 205 - 215
- [39] The role of orientation pinning in statically recrystallized oxygen-free high-conductivity copper wire Metallurgical and Materials Transactions A, 2005, 36 : 205 - 215
- [40] OXIDATION-KINETICS OF CU TO CU2O TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1973, 14 (06): : 423 - 430