共 50 条
- [31] REPAIR OF ELECTROMIGRATION-INDUCED VOIDS IN ALUMINUM INTERCONNECTION BY CURRENT REVERSAL JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1993, 32 (4B): : L624 - L627
- [32] ELECTROMIGRATION IN THIN-FILM INTERCONNECTION LINES - MODELS, METHODS AND RESULTS MATERIALS SCIENCE REPORTS, 1991, 7 (4-5): : 143 - 220
- [36] THEORY FOR ELECTROMIGRATION IN DILUTE ALLOYS JOURNAL OF PHYSICS F-METAL PHYSICS, 1984, 14 (12): : 2943 - 2953
- [38] PHYSICAL SCALING AND INTERCONNECTION DELAYS IN MULTICHIP MODULES IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (01): : 30 - 37
- [39] Scaling of statistical and physical electromigration characteristics in Cu interconnects MATERIALS, TECHNOLOGY AND RELIABILITY OF LOW-K DIELECTRICS AND COPPER INTERCONNECTS, 2006, 914 : 305 - +
- [40] Methodology for Electromigration Signoff in the Presence of Adaptive Voltage Scaling 2014 ACM/IEEE INTERNATIONAL WORKSHOP ON SYSTEM LEVEL INTERCONNECT PREDICTION (SLIP), 2014,